Ball Grid Array (BGA) Adapter Sockel 0.80, 1.00 und 1.27mm zur Verwendung mit BGA Adapter ID-727
Für die Produkte BGA-Sockel und Adapter besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/sockel
Features:
- Advanced® exclusive solder ball terminals offer superior SMT processing
- Same footprint as BGA device
- Proven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs TCE mismatch
- Closed bottom socket terminal for 100% anti-wicking of solder
- Gold contacts allow gold/gold interconnections to Adapter pins
- Low insertion force socket with multi-fingered high reliability Beryllium Copper contacts
- Coplanarity consistently under .006 inch industry standard
- Custom designs available