Ball Grid Array (BGA) Adapter 0.80, 1.00 und 1.27mm zur Verwendung mit BGA Sockel ID-728
Für das Produkt Ball Grid Array (BGA) Adapter 0.80, 1.00 und 1.27mm zur Verwendung mit BGA Sockel besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/sockel
Features:
- Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter´s lower mass
- Uses same footprint as BGA device
- Custom adapters available for heat sink attachment
- Gold plated screw-machined terminals for superior durability
- Unique SMT Adapter provides reliable solution for mounting or socketing LGA or re-worked BGA devices
- SMT Adapters mate with our BGA Sockets for LGA to BGA conversion or SMT Board to Board applications