Flip-Top BGA-Sockel 1.27 und 1.00mm
Für die Produkte BGA-Sockel und Adapter besuchen Sie bitte unsere neue Webseite unter https://www.infratron.eu/sockel
- Designed to save space on new and existing PC boards in test, development, programming and production applications
- No external hold-downs or soldering of BGA device required
- AIC exclusive solder ball terminals offer superior processing
- Uses same footprint as BGA device
- Available with integral, finned heat sink or coin screw clamp assembly