Infratron liefert Steckverbinder für die Elektronik

Features:

• Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter´s lower mass
• Uses same footprint as BGA device
• Custom adapters available for heat sink attachment
• Gold plated screw-machined terminals for superior durability
• Unique SMT Adapter provides reliable solution for mounting or socketing LGA or re-worked BGA devices
• SMT Adapters mate with our BGA Sockets for LGA to BGA conversion or SMT Board to Board applications

Features:

• Advanced® exclusive solder ball terminals offer superior SMT processing
• Same footprint as BGA device
• Proven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs TCE mismatch
• Closed bottom socket terminal for 100% anti-wicking of solder
• Gold contacts allow gold/gold interconnections to Adapter pins
• Low insertion force socket with multi-fingered high reliability Beryllium Copper contacts
• Coplanarity consistently under .006 inch industry standard
• Custom designs available

Features:

• Facilitates easy insertion and withdrawal for high pin count Ball Grid Array devices
• Four extraction screws (supplied) allow BGA adapter to be easily removed from socket. Screws push off socket insulator without damaging device, socket assembly, or the PC board
• Guide box facilitates alignment of male adapter pins with female socket pins, allowing blind mating application
• No special tools required: Four standard screws supplied - easily installed or removed by hand
• Adapter utilizes varied pin lengths for ease of insertion
• Custom designs available

Features:

• Advanced´s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold interconnect
• Small overall size & same footprint as device - only 2.00mm larger than device
• No external hold-downs required
• Unique alignment pins protect pinnfield and aid in hand placementmwith optional stand-offs available
• Sockets and Adapters are provided with protective covers which facilitate automated pick & place
• Superior electrical performance  - very low signal attenuation

• Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) – larger sizes available upon request
• Precision machined spring probes offer high bandwidth with very low insertion loss
• Compact size (small keepout zone) enables use on existing board layouts
• Flip-Top BGA Socket’s easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction
• SMT design eliminates the cost of hardware and mounting holes and their associated interference with traces on the PCB
• Modular design of lower assembly enables simple reflow process, similar to BGA device
• Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum)
• Additional mounting options and custom designs available

• Designed to save space on new and existing PC boards in test, development, programming and production applications
• No external hold-downs or soldering of BGA device required
• AIC exclusive solder ball terminals offer superior processing
• Uses same footprint as BGA device
• Available with integral, finned heat sink or coin screw clamp assembly

• Testsockel für Temperaturtest und Burn-In-Applikationen von -55C bis +200C
• 0,45mm kurze Kontaktstrecke
• Sowohl für HF- als auch für Hochstrom-Anwendungen geeignet
• Das Innenleben kann an alle Gehäuseformen mit Footprint-Rastermaßen von 0,4mm und größer angepasst werden
• Die Kontaktkräfte betragen 20...30 Gramm pro Kontakt

Weitere Informationen auf Anfrage.